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D4.2 Geotracking flexible tag for Industry 4.0 - EXECUTIVE SUMMARY

Major progress and learnings were made during this part of the project. Stress tests were operated on the geotracking tags with better-than-expected resistance and performance considering the size of the embedded electronics module. Functional and radiofrequency tests performed on the tags gave broadly variable results. Further work is required to optimize and improve the yield of the manufacturing process and investigate performance degradation compared to performance observed on ruggedized PCB based tags. However because some of the geolocation flexible tags gave excellent results, comparable to the PCB based tags (or even better in some cases) this leads us to the conclusion that further work is required to reduce process variability and increase yields before manufacturing at scale can be envisaged. This work package has validated the feasibility of geolocation flexible tags without performance degradation in a limited number of cases. Further work will be made considerably easier with the upcoming single IC tag under development and/or a smaller electronic module. Additional work on characterization of the tags depending on the folding conditions is also required.