The MADRAS project has been presented during the IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS 2021), which took place in an online format from 20th – 23rd of June.
The conference had the objective to offer a great forum for research scientists, engineers and other professionals to present and discuss about the latest developments and research findings in the field of flexible electronics, printable sensors, printed large-area systems and hybrid flexible sensors, among others.
During the conference, project partner Gael Depres from Arjowiggins, delivered the presentation titled “Intelligent Packaging by printing sensors on paper” focused on different topics such as printed sensors on paper, recyclability of printed electronics, circular economy and life cycle assessment.
The presentation also included a brief explanation of MADRAS as a key European project for developing advanced materials to fabricate a new generation of plastronic products with enhanced properties to make OLAE-based devices more affordable and durable. Depres mentioned the main work done within the project and presented some results achieved during the first year of MADRAS.
Download the presentation delivered here
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